Products 레이저 미세가공 서비스
Polymer
PET Film
Wavelength : 355nm
PET Film
Wavelength : 355nm
FTO Release (FTO on glass)
Wavelength : 355nm
Polyimide Film
Wavelength : 532nm
Polyimide Film Cutting
Wavelength : 355nm
ITO Scribing (Including Ag)
Wavelength : 355nm
Hole Drilling
Wavelength : 355nm
Thickness : 2.8nm
Polaroid Film Patterning
Wavelength : 355nm
IRO Scribing (Ag Including)
Wavelength : 355nm
PET Film
Wavelength : 10.6µm
PET Easy Cut
Wavelength : 355nm
ITO Patterning (on the PET film)
Wavelength : 355nm
PI Film Circle Cutting
Wavelength : 355nm
Wafer (Ceramics)
Drilling of Si-Wafer
Wavelength : 1064nm
Pulse energy :
Rep rate : 10kHz
Si Wafer Round Cutting
Wavelength : 532nm
Thickness : 520μm
Edge Isolation of Si Solarcell
Wavelength : 1064nm
Pulse energy :
Rep rate : 500kHz
Si Wafer Pattern Cutting
Wavelength : 532nm
Removal of TCO on CIGS + Mo Glass
Wavelength : 1064nm
Removal of CIGS on Mo+Glass
Wavelength : 1064nm
Pulse energy :
Rep rate : 500kHz
Silicone Sheet Hole Drilling
Wavelength : 355nm
Si Wafer Pattern Cutting
Wavelength : 532nm
Si Wafer Pattern Cutting
Wavelength : 532nm
Si wafer Drilling
Wavelength : 532nm
Si Wafer Align Key Marking
Wavelength : 355nm
Si Wafer Circle Cutting
Wavelength : 355nm
Thickness : 700μm
Ceramics
AIN Wafer Hole Drilling
Wavelength : 355nm
Ceramic Hole
Wavelength : 10.6μm
Ceramic Pattern Cutting
Wavelength : 532nm
Alumina Via Hole(70μm)
Wavelength : 1064nm
Thickness : 80μm
Metal
Au Pad Full Scribing
Wavelength : 355nm
Copper Foil Hole Drilling
Wavelength : 532nm
Back Electrode Film Ablation (ZnO on the Glass)
Wavelength : 355nm
Ag Nano Wire Thin-film Scribing
Wavelength : 1064nm
Cu Hole Drilling
Wavelength : 355nm
Thickness : 0.1mm
SUS Hole Drilling
Wavelength : 355nm
Thickness : 0.1mm
Alumina Tube Hole Drilling
Wavelength : 10.6μm
Metal Film Patterning
Wavelength : 355nm
SUS304 Hole Drilling
Wavelength : 355nm
Aluminium Through Line Patterning
Wavelength : 532nm
Metal Oxide Film Ablation
Wavelength : 532nm
Si Wafer Metal Layer Ablation
Wavelength : 355nm
Transparent Materials & Etc.
Quartz Micro-Hole Drilling (Cross-Section)
Wavelength : 355nm
Sapphire Micro-Hole Drilling
Wavelength : 355nm
Thickness : 420μm
Soda-Lime Glass Hole Scribing (Via Hole)
Wavelength : 355nm
Quartz Hole Patterning (Via Hole)
Wavelength : 355nm
Superconductor GdBCO Thin Film Scribing (Cross-Section)
Wavelength : 355nm
Superconductor GdBCO Thin Film Hole Drilling (Through Hole)
Wavelength : 355nm
Quartz Scribing
Wavelength : 10.6μm
Flexible Gorilla Glass Cutting
Wavelength : 355nm
Slide Glass Cutting
Wavelength : 355nm
Glass & Medical
Borosilicate Glass 3.3(Dia 6", 웨이퍼)
Thickness: 1mm
Laser : Femto seconds 1030nm
High precision glass drilling
High precision glass drilling
Stainless steel stent cutting
ITO Glass Top side Results
Wavelengh : 532nm
Top hat beam with pi shaper results
Borosilicate Glass(Bessel beam)
Wavelengh : 1030nm
Thickness : 1mm
Borosilicate Glass(Bessel beam)
Wavelengh : 1030nm
Thickness : 1mm
Pipe 가공 가능 Jig 구축
대면적 CO₂
Epoxy Resin Patterning
Thickness : 355nm
기타
Graphene Cutting
Wavelength : 355nm
Carbon Disk Hole Drilling (100% Carbon)
Wavelength : 355nm