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Products Laser application system

Patterning system with dual mode (Direct writing and Scan mode)

µ-Fab-D2

이 장비는 μ-Fab-D2모델로, Dual mode(Scan mode + Direct writing mode) 동작 가능하고 레이저 3파장으로 구성되어있습니다. Scan mode 동작시, 최대 180mm × 180mm, Direct writing mode 동작시 최대 600mm x 600mm 가공 가능합니다.
  • 레이저: 3-wavelength laser (나노/피코/펨토)
  • 레이저 파장 : IR(1064nm) / 녹색(532nm) / UV(355nm)
  • 듀얼 모드 시스템 : Direct writing mode / scan mode
  • 정밀하게 작은 빔 제어
  • Precisely Alignment tool : On / OFF axis type
  • 하나의 소프트웨어로 제어하기 편리함
  • <40W(IR) / <20W(Green) / <10W(UV) average output power
  • Enclosure safety system
  • Bessel Beam, Top Hat Profile 옵션 가능
  • Scribing / Patterning / Cutting
  • 응용분야 :  ITO/FTO, Perovskite Composite (P1/P2/P3) ,Thin Metal Scribing / Patterning, Si-Wafer, Polymer, Glass Cutting (Bessel Beam Profile)

Dual mode system

  • Dual mode 변환 : 모드를 자동으로 제어
  • Scanner mode : 스캐너를 통한 <20um spot beam control 가능
  • Direct writing mode : 모션 스테이지를 통한 <10um spot beam control 가능

비젼 얼라이먼트 시스템

  • Camera 1
    • 해상도 : 1280 × 960 픽셀 (픽셀 = 3.7um × 3.75um)
    • Field of view(FOV) : 8.0mm × 6.0mm
  • Camera 2
    • 해상도 : 1280×960 픽셀 (픽셀 = 3.7um × 3.75um)
    • Field of view(FOV) : 1.6mm × 1.2mm
  • Alignment accuracy : <±1um

Direct Writing Mode로 FTO Glass 패터닝 예시

  • FTO 층 두께: ~ 700nm
  • 기판: 유리(300mm x 300mm)
  • 처리 속도: 300mm에서 500mm/s
  • 패터닝 폭: 10mm
  • 유리 손상 없음
  • 절연: >30MΩ / 전류: ~ pA

Scan mode로 Flexible Solar Cell Patterning(P1, P2, P3) 예시

Scan mode로 Flexible Solar Cell Patterning(P1, P2, P3) 예시

μ-Fab-D2 System

Laser / Wavelength Pulsed (Nanosecond / Picosecond / Femtosecond)Single, Dual, Triple (1064nm / 532nm / 355nm)
Operation Mode Direct Writing (Fixed Optic), Galvano Scanner
Travel Range
  • 500 x 300mm2 / 300 x 300mm2 Linear Motion Stage, depends on the requirement size
  • Direct Writing, Fixed Optic
  • 180 x 180mm2 - Galvano Scanner
Accuracy ±0.5μm (Direct Writing), ±0.5μm (Scanner)
Repeatability ±0.5μm (Direct Writing), ±1μm (Scanner)
Vision Alignment Off Axis Machine Vision System (1 Camera)
  • Direct Writing - Off Axis Machine Vision System (2 Camera)
  • Scanner - Drawing pattern detection. Quality control, Pattern offset alignment.
Option
  • Autofocusing (by Substrate Thickness Reflection)Bessel Beam, Top Hat (Flat-top), BeamPorous Ceramic
  • Substrate Chuck (Vacuum Fix), Swirling Suction Lens Hood (Fume Removal)
Supported Drawing Format DWG, DXF, JPEG
Application
  • FTO / ITO patterning / Lithium– ion cells cutting
  • Si wafer dicing/scribing / PCB micro hole drilling
  • Scribing(thin metal ,ceramic) / Edge isolation(Solar cell)
  • Selective removal(multi-layered film)
  • Compound ferrite cutting /
  • CFRP(carbon fiber reinforced plastic)cutting /
  • Etc.(polymer, sapphire, glass, quartz..) / Bio Sensor
Dimension (W x D x H). Weight 2650 x 1350 x 1850(mm), 5t / Depending on the machining sample size.
※ Alternative laser module for different wavelength , output power can be adapted depending on the applications